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A*STAR IME consortium delve into advanced packaging

Posted: 10 Jul 2013 ?? ?Print Version ?Bookmark and Share

Keywords:packaging solution? consumer electronics? high power electronics?

A*STAR Institute of Microelectronics (IME) and a group of semiconductor firms have teamed up to form a consortium to address reliability and performance issues in packaging solutions for compact sized consumer electronics and high power electronics. The 12th Electronics Packaging Research Consortium (EPRC12) aims to address the package design, materials and process integration challenges for improved packaging solutions.

EPRC12 consists of 11 members spanning the semiconductor supply chain of the industry from integrated device manufacturers, foundries, packaging houses, to equipment and material companies. Members include Ajinomoto, EV Group, Globalfoundries, Heraeus Materials, Henkel, Infineon Technologies, JSR Micro N.V., Linxens, Tokyo Ohka Kogyo, Academy of Public Security Technology (Hefei) and one other packaging company.

The consortium will focus on three projects to develop advanced technologies for (a) Copper (Cu) pillar interconnect, (b) embedded wafer level packaging (EMWLP) for 3D integrated devices and (c) high power electronics packaging solutions. The Cu pillar project will address the thermo-mechanical issue of the interconnect structure to provide an improved structural integrity for fine pitch interconnection in applications such as processors for consumer electronics. The 3D-EMWLP project will develop solutions to improve the electrical performance for Package-on-Package (PoP) application with medium to high through-mould interconnections. The power electronics packaging project aims to develop a novel packaging solution for power module with junction temperature up to 220C for wide bandgap applications in aerospace, green and renewable energy, as well as future automotives such as hybrid electric vehicles or electric vehicles.





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