Global Sources
EE Times-Asia
Stay in touch with EE Times Asia
?
EE Times-Asia > Manufacturing/Packaging
?
?
Manufacturing/Packaging??

Chip manufacturing equipment value to rebound in 2014

Posted: 18 Jul 2013 ?? ?Print Version ?Bookmark and Share

Keywords:chip manufacturing equipment? wafer? packaging?

The market for chip manufacturing equipment is going to be worth $36.29 billion in 2013, down 1.7 per cent from 2012, but will bounce 21 per cent in 2014 to reach $43.98 billion, according to trades organisation Semiconductor Equipment and Materials International (SEMI).

This puts SEMI's forecasts close to those from market research firm Gartnerprovided in Junewhich had the capital equipment market falling 5.5 per cent to $35.8 billion in 2013 and rising 19 per cent in 2014 to $42.6 billion.

The market for front-end wafer processing equipment is set to grow even faster than other sectors in 2014, jumping 24 per cent to $35.59 billion, up from $28.70 billion in 2013, SEMI forecasts. The assembly and packaging equipment sector will grow 14 per cent to $2.9 billion in 2014 while test equipment grows 6 per cent to $3.18 billion.

Equipment Market Data Subscription

Figure 1: Source: Equipment Market Data Subscription (EMDS), SEMI.

By geography the tyranny of large numbers means that some of the largest regional markets exhibit some of the lowest annual growth and vice versa. Taiwan will be the top spender on chip manufacturing equipment at $10.62 billion in 2014, followed by North America and South Korea at $8.75 billion apiece. Both China and Europe are expected to nearly double their spending in 2014 compared with 2013.

- Peter Clarke
??EE Times





Article Comments - Chip manufacturing equipment value t...
Comments:??
*? You can enter [0] more charecters.
*Verify code:
?
?
Webinars

Seminars

Visit Asia Webinars to learn about the latest in technology and get practical design tips.

?
?
Back to Top