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NTU, STATS ChipPAC work on advanced wafer level packaging

Posted: 14 Aug 2013 ?? ?Print Version ?Bookmark and Share

Keywords:wafer? interconnect? manufacturing?

STATS ChipPAC today announced that it has teamed up with Nanyang Technological University (NTU) in Singapore to focus on further developing wafer level packaging and interconnect technologies as well as advancing research on new materials and manufacturing processes.

NTU, ranked among Asia's top ten universities by higher education information provider Quacquarelli Symonds, was chosen by STATS ChipPAC because of its strong research culture and expertise to develop progressive packaging solutions, said EVP and CTO Dr. Han Byung Joon. The partnership is in alignment with the company's on-going commitment to making Singapore its hub for advanced wafer level technology R&D and post wafer fab process for mobile convergence devices.

Back in May, STATS ChipPAC collaborated with another prominent Singapore-based research organisation, the A*STAR Institute of Microelectronics, and Qualcomm Technologies to develop 2.5D/3D IC technology building blocks. (See Collaboration to yield low cost interposers for 2.5D ICs.)

However, the company also announced in July that its leaded wirebond packaging and related test operations in Kuala Lumpur will be consolidated into its Shanghai facility over the course of this year and 2014, eventually closing down its Malaysia plant altogether (see STATS ChipPAC to shut down Malaysia plant). Roughly a thousand employees, or about 11 per cent of STATS ChipPAC's total workforce, will be affected by the plant closure.

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