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SACM drastically improves drop-shock performance

Posted: 16 Aug 2013 ?? ?Print Version ?Bookmark and Share

Keywords:Indium Corporation? SACM? solder alloy? portable electronics?

A new technology platform using the SACM solder alloy satisfying the continuing demand for cost-effective reliability requirements of portable electronic devices has been revealed by Indium Corporation. The SACM solder alloy offers drop shock performance far superior to other SAC alloys, without compromising on thermal cycling. Its low silver content makes this a cost-effective solution for portable electronics.

The platform consists of Indium8.9 Series solder pastes using the company's patented-pending SACM solder alloy technology for board-side interconnect, and SACM solder balls (spheres) for package level interconnect.

"SACM's stable, micro-structural improvements to the intermetallic compound layer of the solder-to-pad interface are impressive. We see a fine grain size with a thin, stable IMC layer, even after exposure to accelerated life conditions. These micro-structural improvements translate into an 8X (800 per cent) improvement in drop-shock performance and 50 per cent extension in thermal cycling," said Dr. Ning-Cheng Lee, Indium Corporation's vice president of technology.

The portable electronics industry is faced with the ongoing challenges, such as improving drop-shock performance without sacrificing thermal cycling performance, the need to reduce expensive board-level underfills (and the associated material, process and re-work costs), as well as the inability to even reach some areas with underfill, and reducing costs by extending wafer-level package size to larger areas, enabling higher functionality of the low cost-per-I/O package.

Solder joint architectures that utilise both SACM solder paste and SACM solder balls can maximise reliability benefits with enhanced interfaces for both solder-to-package and solder-to-printed circuit board.





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