Global Sources
EE Times-Asia
Stay in touch with EE Times Asia
?
EE Times-Asia > Memory/Storage
?
?
Memory/Storage??

SMART rolls eMMC line, expands flash storage solutions

Posted: 19 Aug 2013 ?? ?Print Version ?Bookmark and Share

Keywords:SMART Modular Technologies? eMMC? BGA? NAND flash?

Memory module manufacturer SMART Modular Technologies recently announced that it has expanded its flash based storage solutions, adding a new eMMC product line.

The new eMMC line is available in both an industrial-temp (-40C to 85&degC) and extended-temp (-25C to 85C) version. It is comprised of two different ball-grid array (BGA) configurations. Customers have an option to pick either a 100-ball, 1.0mm pitch package measuring 14x18mm, or a 169-ball, 0.5mm pitch package measuring 12x16mm. Both configurations are available in 8Gb or 64Gb densities.

Compliant to the JEDEC eMMC standard v4.5/4.51, SMART Modular eMMC products are manufactured in ISO-9001, ISO-14001 and TS-16949 certified facilities to the stringent requirements and certifications as mandated by automotive and industrial OEM's; such as AEC-Q100 compliance. SMART also adheres to PPAP BOM control and documentation requirements.

SMART Modular's eMMC products offer a cost-effective NAND Flash storage solution that simplifies system design by making the complexity of the underlying NAND Flash technology invisible to the host system. This enables easier design-in, reduced time-to-market, and simpler migration as NAND Flash technology scales.

System designs can benefit from additional features available in SMART's eMMC products such as: large boot partition size, configurable user area to pseudo-SLC mode, robust power loss protection and device health status reporting.





Article Comments - SMART rolls eMMC line, expands flash...
Comments:??
*? You can enter [0] more charecters.
*Verify code:
?
?
Webinars

Seminars

Visit Asia Webinars to learn about the latest in technology and get practical design tips.

?
?
Back to Top