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Sand 9's MEMS timing chips built for mobile apps

Posted: 05 Sep 2013 ?? ?Print Version ?Bookmark and Share

Keywords:Sand 9? MEMS? timing products? wireless connectivity?

Sand 9 recently announced its micro-electromechanical systems (MEMS) timing products specifically designed to meet the stringent performance, cost, size and reliability requirements of high-volume mobile applications such as 3G/4G cellular and GPS/GNSS as well as low-power wireless connectivity applications such as Bluetooth Smart. Sand 9's TM361 and TM061 support integration with mobile and wireless connectivity chipsets, conserving board space and reducing bill of materials.

The TM361 is based on Sand 9's Temperature Sensing MEMS Resonator (TSMR) platform and aims to replace temperature-sensing crystals (TSXs) for cellular transceiver and GPS/GNSS/WiFi wireless connectivity chips. The device is also a MEMS resonator with a built-in temperature sensor and heater for temperature compensation and calibration.

The TM061 is based on the company's MEMS Resonator (MR) platform and meets the demands of the Internet of Things (IoT), wireless-everywhere ecosystems necessitating devices that are rugged, low-power, low-cost and very small in size. The devices is a MEMS resonator only, and does not include a temperature sensor, heater or oscillator circuit. It serves as a quartz crystal replacement for low-power wireless connectivity applications such as Bluetooth Smart. Like all MEMS timing products from Sand 9, it can be overmolded without impacting performance, providing the size reduction required to enable the IoT.

Sand 9 also announced a new platform on its roadmap, the Temperature Sensing MEMS Oscillator (TSMO). TSMO products will include an oscillator circuit, to guarantee phase noise while providing another level of integration for mobile applications. As with TSMR products such as the TM361, TSMO products will meet the precision timing requirements of cellular transceivers and GPS/GNSS/WiFi combo integrated circuits (ICs).

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