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PVD system enables power devices' 300mm transition

Posted: 09 Sep 2013 ?? ?Print Version ?Bookmark and Share

Keywords:SPTS Technologies? physical vapor deposition? power device? silicon substrate?

SPTS Technologies recently launched of its Sigma fxP physical vapor deposition (PVD) system for 300mm power device manufacturing. Options for the system include modules for frontside thick aluminium processing and backside metal deposition on ultra-thin wafers. The SPTS' new system is designed to address the technical challenges customers face as they scale power PVD processes up to 300mm wafer size.

"We are pleased to offer customers a complete solution for 300mm Power PVD processing," said Chris Jones, a product marketing manager at SPTS. "Sigma fxP systems are in full production for frontside thick Al and thin wafer backside processing. We are prepared to support the IDMs and foundries as they make the transition from 150 and 200mm wafer formats to 300mm."

In a discrete MOSFET power device, current passes through the silicon substrate so electrical contacts are required on both sides of the wafer. Due to the high currents involved, thick aluminium alloy layers are deposited on the frontside of the wafer (typically > 4?m rather than fxP design overcomes that challenge without compromising throughput. Sigma fxP users routinely deposit thick Al layers at rates >1.4?m/min without any yield destroying whiskers or extrusions.

With frontside processing complete, wafers are thinned down to 50?m or less to reduce 'on-state' resistance and solder metal layers are deposited on the backside. No supporting carrier substrates are used and the ultra-thin, large area wafer will deform under the influence of uncontrolled film stresses, with miss-handling a potential consequence. The Sigma fxP carries thin wafer handling hardware and uses film deposition stress control techniques to deliver high throughput processes with low wafer bow.

Currently, seven out of the top ten power device manufacturers, and all major foundries use the Sigma fxP as the process tool of record for power PVD processing. With power device manufacturing moving to 300mm format wafers, SPTS has successfully transferred its market leading process knowledge and capability to the new platform.

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