Global Sources
EE Times-Asia
Stay in touch with EE Times Asia
?
EE Times-Asia > Manufacturing/Packaging
?
?
Manufacturing/Packaging??

Richardson reveals extrusion profiles from Wakefield-Vette

Posted: 07 Oct 2013 ?? ?Print Version ?Bookmark and Share

Keywords:extrusion profile? thermal management?

Richardson RFPD has announced the release and full thermal analysis support for an extensive inventory of extrusion profiles from Wakefield-Vette.

The portfolio includes more than thirty-five stocked extrusion profiles along with a range of thermal management products such as bonded fin heat sinks and liquid cold plates, as well as thermal management accessories such as clamp compression systems, thermal compounds, adhesives and interface material. Richardson RFPD also offers complete fabrication and plating capabilities for non-standard requirements.

The selection of thermal management products combined with Richardson RFPD Design Advisor services support a range of RF, energy and power applications including those requiring natural air convection, forced-air and liquid-cooled solutions.

Richardson RFPD's inventory of extrusion profiles supports machine shops by offering immediate availability of raw material, while Richardson RFPD's machining capabilities support prototype and pre-production quantity requirements for OEMs.





Article Comments - Richardson reveals extrusion profile...
Comments:??
*? You can enter [0] more charecters.
*Verify code:
?
?
Webinars

Seminars

Visit Asia Webinars to learn about the latest in technology and get practical design tips.

?
?
Back to Top