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Cable-to-board 3M interconnects allow high-density designs

Posted: 08 Oct 2013 ?? ?Print Version ?Bookmark and Share

Keywords:insulation displacement contact? interconnects? PCB?

3M Electronics Solutions Division has rolled out its 3M Ribbon Cable Wiremount Socket Assembly, 0.50 x 0.50in, 451 series and the 3M Shrouded Boardmount Header, 0.50 x 0.50in, 452 series. According to the firm, the socket and header mate together connecting 0.025in pitch ribbon cables to PCBs.

The compact header and socket help achieve high-performance electronic equipment designs in a small form factor as required by today's communications, military/aerospace, industrial production, data centre and high-performance computing applications, noted 3M. The 0.050in pitch claims to save space on the PCB, allowing for high connection density.

The 451 and 452 series interconnect products from 3M also promise to deliver on performance, reliability and cost savings. The ribbon cable wiremount socket assembly incorporates 3M insulation displacement contact (IDC) technology in the connector, helping maintain secure connections and high signal integrity. The IDC connector's mass termination capability allows the termination of 30 lines in a single cycle, reducing the need for expensive automated termination equipment and allowing manual cable assembly operations. Available friction-latch configurations and an optional strain-relief accessory can further increase connection reliability. An optional, unique header ejector latch mechanism provides positive latch and ejection capability with minimal size addition.

The shrouded boardmount header is available in a variety of configurations in order to maximise design flexibility while minimising PCB footprint. Tape-and-reel packaging for the SMT version of the header is available for automated placement applications, and PCB standoffs help enable pin-in-paste processing capability.

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