Global Sources
EE Times-Asia
Stay in touch with EE Times Asia
EE Times-Asia > EDA/IP

TI's SDK aimed at low-power DSP + ARM devices

Posted: 14 Nov 2013 ?? ?Print Version ?Bookmark and Share

Keywords:Texas Instruments? SDK? DSP? ARM? OMAP processor?

Texas Instruments (TI) has announced the availability of its multicore software development kit (MCSDK) on the low-power OMAP-L138 and OMAP-L132 DSP + ARM9 processors. According to the company, it gives developers reduced development time and scalability to TI's TMS320C6000 high-performance digital signal processors (DSPs). It also allows customers developing applications for industrial, communications, telecom and medical markets to migrate to high-performance devices without moving to another software platform, added TI.

TI's MCSDK claims to provide highly-optimized bundles of foundational, platform-specific drivers to enable development on TI's devices. Providing well-defined application programming interfaces for ease of programming, the MCSDK supports future portability to higher performance TI multicore platforms so that customers do not have to develop common layers from scratch. The MCSDK gives developers the ability to evaluate hardware and software capabilities of the device-specific development platforms and to rapidly develop multicore applications. In addition, it enables applications to use SYS/BIOS and/or Linux on one platform. Typically the MCSDK individual cores can be assigned to operate Linux applications as a control plane while other cores are simultaneously assigned high-performance signal processing operations. This heterogeneous configuration provides software developers the flexibility to implement full solutions on TI's multicore processors. In the case of TI's OMAP-L138, the internal ARM9 processor can be assigned with a high-level operating system, such as embedded Linux, performing complex IO stack handling, while the TMS320C647x DSP runs TI RTOS (previously SYS/BIOS) real-time processing tasks.

The MCSDK contains libraries that are compatible with TI's C647x DSPs and KeyStone-based DSPs including the C665x, C667x, 66AK2Hx and 66AK2Ex processors. With the MCSDK, developers are able to access and benefit from various optimized DSP libraries including the Math Library, Digital Signal Processing Library, Image and Video Processing Library, Telecom Libraries and Speech and Video Codecs. In addition, TI's OMAP-L138 processor is packed with a unique combination of application-tuned features and peripherals including Ethernet, USB, SATA, Video Port Interface (VPIF), uPP and more.

TI's MCSDK for the OMAP-L138 processor is free to download. The OMAP-L138 LCDK (TMDXLCDK138) development kit is available for $195.00 through the TI eStore or through distribution partners.

Article Comments - TI's SDK aimed at low-power DSP + AR...
*? You can enter [0] more charecters.
*Verify code:


Visit Asia Webinars to learn about the latest in technology and get practical design tips.

Back to Top