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Ams offers cost-efficient IC prototyping service

Posted: 15 Nov 2013 ?? ?Print Version ?Bookmark and Share

Keywords:Ams? prototyping? sensor? CMOS? IBM?

Ams AG's Full Service Foundry business unit has rolled out what the company describes as fast and cost-efficient IC prototyping service with an updated schedule in 2014. Known as Multi-Project Wafer (MPW) or shuttle run, the prototyping service, which is suited for applications such as smart sensors, sensor interface devices, smart meters, industrial and building controls, and LED lighting control in the automotive, industrial and medical markets, combines several designs from different customers onto a single wafer, offers significant cost advantages for foundry customers as the costs for wafers and masks are shared among a number of different shuttle participants, stated the firm.

Ams' MPW service includes the whole range of 0.18um and 0.35um specialty processes. In order to provide leading analog semiconductor process technologies, manufacturing and services, Ams offers four MPW runs in 0.18um CMOS (C18) process as well as four MPW runs in its advanced 0.18um high-voltage CMOS (H18) technology. The H18 process technology is based on IBM's industry-proven 0.18um CMOS process CMOS7RF and offers RF integration and high density SoC capability.

For the 0.35um specialty processes, which are based on the 0.35um CMOS process transferred from TSMC, a total of 14 runs are offered in 2014: Ams' 0.35um high-voltage CMOS process family with a 20V CMOS option, which is suited for power management products and display drivers; a 50V CMOS option, which has been optimized for automotive and industrial applications; and a 120V module, which meets the requirements of sensor and sensor interface chips in high-voltage applications. The advanced high-voltage CMOS process with embedded Flash functionality adds to Ams' MPW service portfolio. The CMOS compatible 0.35um SiGe-BiCMOS technology S35 enables RF circuit designs with an operating frequency of up to 7GHz combined with high-density digital parts on one single ASIC.

Overall, Ams will offer almost 150 MPW start dates in 2014, enabled by long lasting co-operations with partner organizations such as CMP-TIMA, Europractice, Fraunhofer IIS and Mosis. Japanese customers may also participate via our local MPW program partners Toppan Technical Design Center Co. Ltd (TDC) and Dai Nippon LSI Design Co Ltd.

To take advantage of the MPW service, Ams' foundry customers deliver their completed GDSII-data on specific dates and receive untested packaged samples or dies within a short lead-time of typically 8 weeks for CMOS and 12 weeks for high-voltage CMOS, SiGe-BiCMOS and embedded

Flash processes.





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