Global Sources
EE Times-Asia
Stay in touch with EE Times Asia
?
EE Times-Asia > Manufacturing/Packaging
?
?
Manufacturing/Packaging??

Novel dielectric material to enhance eWLB packages

Posted: 22 Nov 2013 ?? ?Print Version ?Bookmark and Share

Keywords:Nanium? eWLB package? dielectric material? FOWLP?

Nanium S.A., a semiconductor assembly and test service provider, has developed what it describes as an improved dielectric material and process solution for its fan-out wafer-level packaging (FOWLP) technology, embedded wafer-level ball grid array (eWLB). The company noted that the material exhibits

excellent mechanical stability, serving as the main glue for eWLB packages.

According to Steffen Kroehnert, director of technology at Nanium, the dielectric material boasts twice the tensile strength of traditional solutions, while featuring ten times the elongation to break. It also withstands higher temperature cycling, over 1000 cycles in the component-level-based temperature cycling test (TCT -55°C to 125°C), according to JEDEC JESD47 (condition B) and 1,000 cycles in the board-level-based temperature cycling on board test (TCoB -40°C to 125°C), according to IPC-9701 (condition TC3).

"We are working on widening our FOWLP technology to match automotive requirements, testing the materials at over 125°C too", explained Kroehnert . "This makes eWLB very attractive to replace bulkier lead-frame packages and extends our existing technology platform into the more demanding medical, automotive and space market" he added.

Fan-Out WLP eWLB

Basic construction Fan-Out WLP eWLB with single die embedded.

The new material was already tested in eWLB products to cover a wide range of package configurations, with varying package size and thickness. The use of silicon interposers would be the next step in package miniaturization, but it is not cost-competitive with PCB-based fan-out wafer-level packaging.

"While the current BGA ball-pitch standards are 500, 400 or 350um, we can work with pitches down to 200 or even 100um, hence we still have quite some margin to scale down our packages before the more expensive silicon interposers come into play at even finer pitches."

eWLB based WLSiP

Schematics of multi-die integration in eWLB based wafer level System-in-Package (WLSiP) with two active dies and eight passives.

The company also has the capability to integrate passives components (replacing up to 50 discrete parts) into its eWLB products. What's more, in cooperation with Europe's leading PCB manufacturer AT&S, Nanium is developing a way to embedded the eWLB packages on top of PCB substrates.

"By identifying the trends in packaging, seeing where customers want to go, we are better able to look for new directions in R&D, new materials," added Kroehnert.





Article Comments - Novel dielectric material to enhance...
Comments:??
*? You can enter [0] more charecters.
*Verify code:
?
?
Webinars

Seminars

Visit Asia Webinars to learn about the latest in technology and get practical design tips.

?
?
Back to Top