Qi compliant wireless power receiver cuts heat generation

Toshiba Corp. has announced a wireless power receiver IC that the company said complies with Qi Standard Low Power Specifications version1.1, defined by the Wireless Power Consortium (WPC). According to the firm, the TC7761WBG will be used in wireless power supply applications including smartphones and mobile accessories.

ICs used in mobile applications such as smartphones are required to generate heat at low level to prevent overheating. The TC7761WBG is fabricated with a combined CMOS-DMOS wafer process that cuts heat generation to 70 percent that of an equivalent product while achieving 95 percent power conversion efficiency. The IC's built-in protocol authentication circuit eliminates the need for an external MCU, contributing to simplification of the system.

The Qi-compliant TC7761WBG includes Foreign Object Detection (FOD) function and supports output power up to 3.5W. The wireless power receiver IC is available in a WCSP28 package. Mass production shipments of the IC have started rolling out.