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MediaTek's global strategy to benefit CEVA

Posted: 13 Jan 2014 ?? ?Print Version ?Bookmark and Share

Keywords:CEVA? MediaTek? LTE? CDMA2000? worldphone?

MediaTek, a Taiwan chip behemoth that dominates the Chinese market, has announced its plan to establish a foothold in the United States in addition to Europe and Japan. For that, the company has new ammo: a multimode-LTE modem chipset that is going through operators' arduous certification process; and an advanced "worldphone" SoC that will incorporate CDMA2000. However, the commercial version of the worldphone won't hit the market until early 2015, noted the firm.

Dubbed MT6290, MediaTek's LTD chipset handles both FDD and TDD modes. Designed for broad compatibility with mobile operator networks worldwide, the chip supports the DC-HSPA+, W-CDMA, TD-SCDMA, EDGE and GSM/GPRS radio technologies, in addition to LTE.

Still missing in the radio mix is CDMA2000.

MediaTek addressed the issue this week by announcing collaboration with VIA Telecom for integrating VIA's CDMA2000 technology into MediaTek's upcoming worldphone SoC.

The move, in turn, will open the door for CEVA, a DSP core IP vendor, to seek a big design win in MediaTek's SoC. This is possible because CEVA's TeakLite DSP core is used at the heart of VIA Telecom's CDMA2000 baseband solution.

While CEVA CEO Gideon Wertheizer declined to publicly connect the dots, MediaTek president C.J. Hsieh, in an interview with EE Times, confirmed that CEVA will be in MediaTek's worldphone SoC.

C.J. Hsieh

MediaTek President C.J. Hsieh expects a design win for its LTE modem and application processor in the second quarter this year.

Qualcomm and Samsung are the two biggest LTE modem players, and Huawei (through its HiSilicon chip subsidiary) is in the Chinese and Korean LTE markets, according to Will Strauss, president of Forward Concepts, the Arizona-based market research company. Marvell also recently cracked the China market with an LTE and TD-SCDMA modem, Strauss added.

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