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STATS ChipPAC makes IEEE patent ranking

Posted: 23 Jan 2014 ?? ?Print Version ?Bookmark and Share

Keywords:semiconductor packaging? test? patent? IP?

Singapore-based STATS ChipPAC, a provider of advanced semiconductor packaging and test services, announced that it has been ranked for the third consecutive year among the world's top 20 semiconductor manufacturing companies in the 2013 Patent Power Scorecard published by IEEE Spectrum, the flagship magazine of the Institute of Electrical and Electronics Engineers (IEEE).

"Today's consumers want more powerful yet increasingly smaller electronic devices. Semiconductor packaging technology is a driving force in achieving smaller, faster, multi-functional devices," said STATS ChipPAC EVP and CTO Han Byung Joon. The company is the only outsourced semiconductor assembly and test service provider ranked among the top 20 companies in the Semiconductor Manufacturing category. Han added, "We have developed a continuous path of innovative and cost effective advanced packaging solutions that provide numerous advantages to customers in the mobile communications market as well as new and evolving markets such as cloud computing and wearable devices."

With over 60 per cent of its IP in wafer level packaging, flip chip interconnect and 2.5D/3D integration, STATS ChipPAC has been granted more than 1,000 patents by the U.S. Patent and Trademark Office. Its manufacturing facilities are strategically located in South Korea, Singapore, China, Malaysia and Taiwan.

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