Adhesive film boasts extreme temperature capabilities

Rogers Corp. has introduced the COOLSPAN thermally and electrically conductive adhesive (TECA) that according to the company delivers reliable high temperature performance.

The COOLSPAN TECA film is a thermosetting, epoxy based, silver filled adhesive film used to bond circuit boards to heavy metal backplanes, heat sink coins and RF module housings. The adhesive can be used as an alternative to fusion bonding, sweat soldering, mechanical, or press fit metal attachment. This film provides both a thermally and electrically conductive bond interface.

COOLSPAN TECA film is supplied in sheet form on a PET carrier and is easy to handle when converting into preforms and when peeling from the carrier, stated the company. It is able to survive lead-free solder processing and offers outstanding chemical resistance and high temperature performance, helping you to keep things cool.

The film has been demonstrated to easily survive five times lead-free solder exposures, 1000 hours at 85C/85 percent RH, and 190℃ for ten days, the firm added.