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Toshiba touts photorelays in industry's smallest package

Posted: 04 Feb 2014 ?? ?Print Version ?Bookmark and Share

Keywords:Toshiba? photorelay? photocoupler?

Toshiba Corp. has introduced its photorelays available in what it says is the industry's smallest package. The TLP3403 and TLP3412 use the Toshiba-developed very small outline non-leaded (VSON) package. Compared to equivalent Toshiba products in a USOP package, the photorelays reduce the assembly area by half and volume by 60 percent. This can contribute to the development of smaller and thinner sets and also makes it possible to increase the number of photorelays on a circuit board to 1.3 times to 1.5 times that of conventional products, added the company.

TLP3403 and TLP3412

Also, by using a new internal structure, a chip-on-chip structure, the products, while retaining the same electrical characteristics as conventional USOP package products, secure improved high-frequency characteristics, which are necessary for signal transmission. The photocouplers are geared for various tester applications, especially for use in power-line switching and measuring-line switching.

The devices feature a maximum area of 1.5 x 2.5mm (max), trigger LED current of 3mA (max), equivalent rise time of 40ps (typ) and isolation voltage of 300Vrms (min). The TLP3403 boasts an on-state current of 1A (max), off-state voltage of 20V (min) and off-state capacitance of 40pF (typ). The TLP3412 features an on-state current of 0.4A (max), off-state voltage of 60V (min) and off-state capacitance 20pF (typ). Shipment of mass production devices have started.

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