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TDK boasts industry's smallest multilayer diplexer

Posted: 13 Mar 2014 ?? ?Print Version ?Bookmark and Share

Keywords:TDK? diplexer? WLAN? smartphone? Bluetooth?

TDK Corp. has developed a multilayer diplexer in case size IEC 1005 for the application of 2.4GHz/5GHz band WLAN in smartphones and other mobile devices. Featuring a footprint of 1 x 0.5 x 0.4mm, the DPX105950DT-6010B1 diplexer is touted by the company as the smallest in the industry.

According to TDK, the volume of the component is more than 60 per cent smaller than existing 1608 diplexers. In spite of the significant size reduction, the diplexer offers equal or even better insertion loss and attenuation performance, stated the company. For example, the maximum low band insertion loss at 2.4-2.5GHz is just 0.5dB, while the high band attenuation in the same frequency range is at least 25dB. Mass production of the diplexer started in February 2014.

DPX105950DT-6010B1 diplexer

Diplexers are electronic components used in the antenna input/output section to divide or combine two different frequency bands. The product features a combination of layers with different dielectric constants, which are produced using TDK's co-firing technology. TDK was able to further miniaturize its diplexer by using even thinner ceramic layers and finer conductor lines. The product is rated for an operating temperature of -40°C to 85°C and is suitable for use in the Bluetooth and WLAN circuitry in mobile devices, added the company.

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