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Handling, assembly of quad flat package

Posted: 07 Apr 2014 ?? ?Print Version ?Bookmark and Share

Keywords:Freescale? QFP? Printed Circuit Board? PCB? Moisture Sensitivity Level?

This application note provides guidelines for handling and assembly of Freescale QFP packages during Printed Circuit Board (PCB) assembly.

Guidelines for PCB design, rework, and package performance information such as Moisture Sensitivity Level (MSL) rating, board level reliability, mechanical and thermal resistance data are included for reference.

View the PDF document for more information.

Originally published by Freescale Semiconductor at as "Quad Flat Package (QFP)".

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