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LTE physical layer module gives savings boost to OEMs

Posted: 07 Apr 2014 ?? ?Print Version ?Bookmark and Share

Keywords:LTE? CommAgility? MIMOon? OEM?

CommAgility and MIMOon GmbH have worked together on an LTE physical layer solution that integrates the latter's configurable software into the former's advanced mezzanine card (AMC) for LTE applications including eNodeB implementations, test equipment, specialised systems and research and development projects.

The AMC D24A4 RF4 is a double-width module built around TI's SoC architecture designed for high performance wireless infrastructure applications. For additional processing, it also provides two TI multi-core DSPs and a Xilinx Kintex-7 FPGA. The module includes a 4x4 RF interface. Multiple CPRI interfaces are also available for applications requiring external remote radio heads, and the card is available without integrated RF as the AMC-D24A4.


The mi!SmallCellPHY software, on the other hand, provides a complete LTE physical layer for pico-, femto, and micro-cells on SDR, DSP and ASIC platforms. It is fully compliant with 3GPP Releases 8 and 9, and optimised for low memory, processing power and power consumption.

The module is aimed at 4G LTE, LTE Advanced and 5G systems that require MIMO technologies, and enables complete RF to Layer 3 wireless basestation functionality to be implemented on a single card.

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