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TI unveils low-power MCUs in compact package

Posted: 09 Apr 2014 ?? ?Print Version ?Bookmark and Share

Keywords:Texas Instruments? MCU? FRAM? consumer electronics? tablet?

Texas Instruments has announced additional products to its ultra-low power MSP430 MCU portfolio. According to the company, developers can now design smaller products with the ultra-low power FRAM-based MSP430FR5738 and Flash-based MSP430F51x2 MCUs in wafer-level chip scale packages (WLCSP) as small as 2.0 x 2.2 x 0.3mm.

These tiny package sizes make MSP430 MCUs ideal for a variety of ultra-low power applications such as sensor hubs, digital credit cards, ingestible sensors, health and fitness products including smart watches, and consumer electronics such as tablets and notebooks, noted TI.

According to the company, the features and benefits of TI's expanded portfolio of tiny package MCUs include: devices with embedded FRAM memory such as MSP430FR5738 MCUs provide longer battery lifetime for ultra-low power data logging applications; available with 1.8V I/O on MSP430F5229 MCUs to enable applications with advanced sensor fusion capabilities such as gesture recognition, motion tracking, environment sensing and contextual awareness; ecosystem of libraries and support eases USB development on MSP430F5528 MCUs in consumer electronics applications such as smartphones, notebooks and tablets; range of 1.8V and 5V tolerant I/O on MSP430F51x2 MCUs allow developers to interface with a broader range of components, in addition to a PWM timer for high-resolution applications; and broad GPIO range (32-53) allows MSP430 MCUs flexibility in the system, enabling more advanced features like environmental sensors.

The ultra-low power MSP430 MCUs are available starting at $1.08 in 1K units.

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