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Assembly handling, thermal mgmt for lidless FC-PBGA

Posted: 26 May 2014 ?? ?Print Version ?Bookmark and Share

Keywords:assembly handling? thermal management? lidless? Flip Chip? Plastic Ball Grid Array?

This application note provides recommendations on the assembly handling and application of thermal management solutions for lidless Flip Chip Plastic Ball Grid Array (FCPBGA) components. Freescale's FC-PBGA is a laminate-based BGA packaging solution that provides competitive solutions for higher performance applications.

???Improved board-level, solder-joint reliability and lower cost compared to FC CBGA
???Custom substrate designs / ball maps for maximum routing flexibility and electrical performance
???Custom ball patterns / full arrays / depopulated arrays available, up to ˜1300 I/O
???Substrates use standard organic PCB manufacturing and HDI build up technologies
???FC-PBGA footprint is a drop-in replacement (PCB design and board assembly) for WB PBGA for the same ball diameter and pitch
???Capability to withstand leadCfree reflow processes (260C reflow)
???Proven reliability in industrial environments
???LeadCfree solder balls available

View the PDF document for more information.

Originally published by Freescale Semiconductor at as "Assembly Handling and Thermal Solutions for Lidless Flip Chip Ball Grid Array Packages".

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