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Path Finder streamlines IC packaging across multiple PCBs

Posted: 10 Jun 2014 ?? ?Print Version ?Bookmark and Share

Keywords:Path Finder? IC? packaging? PCB?

Mentor Graphics Corp. has released a product suite, which facilitates smart planning and optimisation decisions related to cost and performance of the IC package in the context of the multiple PCBs.

The Xpedition Path Finder suite provides a single environment that gives cross-domain design teams the ability to model every device/interface to the level of detail and accuracy they require. IC layout design data can be represented as a virtual die model containing all of the IC-level detail specific to the co-design and optimisation process. Board design data can be modelled as individual interfaces or as complete designs. Packages can be built based on industry-leading pin array generation and manipulation capabilities, existing devices, and industry-standard formats.

The suite features what is claimed is the industry's first path-finding methodology that automates the planning, optimisation, and connectivity from a chip through multiple packaging variables, while targeting multiple and different PCB platforms.

Using the multi-mode connectivity environment, designers can capture and manage connectivity based on their preference: table-based, graphical schematics, or automated. Cross-domain pin mapping and net combining can easily be managed in all modes of connectivity capture.

In addition, users can perform rules-based pin/ball-out studies from their respective domains, by signal, bus or interface, visualizing the impact across the complete system in real time. Path Finder also streamlines and automates the library development process, reducing a several day task down to a few minutes.

Path Finder Technologies

Xpedition Path Finder suit comprises all the tools necessary for efficient package/PCB co-design for a single product, or for incorporating into multiple form factors with different physical constraints. Source: Mentor Graphics

It leverages other tools from the company such as the HyperLynx signal and power integrity product, 3D full-wave EM analysis tools, Xpedition layout technology, the FloTHERM CFD thermal modelling tool, visECAD/CAMCAD design comparison tool, and Valor NPI substrate fabrication checking tool.

The Xpedition Path Finder suite is available and is an EDA vendor-neutral flow.

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