Thermal measurement methodology of RF power amps

This document explains the methodology used by Freescale for thermal measurement of high power RF (Radio Frequency) power amplifiers (RFPA). Semiconductor device reliability heavily depends on device operating temperature so the accurate thermal characterisation of these high power devices is crucial in establishing the reliability of the systems that use such devices.

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Originally published by Freescale Semiconductor at www.freescale.com as "Thermal Measurement Methodology of RF Power Amplifiers".