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White-chip scale packages offer up to 80% cost reduction

Posted: 01 Sep 2014 ?? ?Print Version ?Bookmark and Share

Keywords:SemiLEDs? luminaire? mobile device? LCD?

SemiLEDs Corp. has rolled out its white chip scale packages, the ReadyMount Enhanced CSP, or EC series. By combining Enhanced Flip chip (EF) approach with its innovative ReadyWhite phosphor technology, the EC claims to deliver unique flexibility, reliability and manufacturability in a single 1.4 x 1.4mm low profile device.

Rated for input power of up to 3W, the EC is a fully packaged white emitter SMD component, ready for surface mounting on any board level module or COB application, lowering capital costs and enabling extremely high lumen density configurations, noted the company.

The innovation promises to reduce final component by half, with a packaging cost reduction of up to 80 per cent over conventional packaging. EC series products, such as the EC-W1414, claim to enable system-integrators and luminaire manufacturers a direct path to a highly cost effective solution on a per-lumen basis, with additional viewing angles and die sizes under development.

While useful for creating compact multi-die white packaged LEDs, the ReadyMount products will benefit light-engine and luminaire manufacturers who have previously had to rely exclusively upon packaged die solutions. Incorporating the SemiLEDs EF series FlipChip, the electrical contacts are moved to the bottom of the chip leaving an emitting surface that is uninterrupted by wire bonds or top-side electrodes. The result is a compact chip scale package, 0.4mm high, which can produce outputs of up to 300lm at 1A. The SemiLEDs EC series is available in standard ReadyWhite correlated colour temperatures ranging from 2700K to 10,000K with colour rendering indices up to 90 minimum.

In addition to the manufacturing benefits of the chip scale package, elimination of the wire bonds also improves the optical integration characteristics by taking advantage of the unobstructed and nearly edge-to-edge emitting chip surface that enables the die to be mounted close together, stated SemiLEDs. This simplifies the optics by eliminating the need for complex mixing lenses which are used to control ghosting and shadows in narrow beam applications. The glass top surface is also very mechanically robust, and is not prone to the handling damage or stresses faced by wire-bond or flip chips with a silicone covering. The typical 145 degree field of view also demonstrates good colour-over-angle characteristics as a result of the ReadyWhite technology, the company added.

By enabling densely packed mounting with simplified optics, the SemiLEDs EC series is gesred for general lighting applications including indoor and outdoor lighting, architectural lighting, and torches/flashlights. The rugged architecture and compact size of the single white die are additionally well suited for mobile device flashes and LCD backlighting applications.

SemiLEDs' CSP series of LED chips is RoHS compliant with production quantities available now.

- Paul Buckley
??EE Times Europe

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