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Manufacturing/Packaging??

Wire-to-board connector features crimp contact system

Posted: 07 Oct 2014 ?? ?Print Version ?Bookmark and Share

Keywords:connector? DF63? wire-to-board? contact?

Hirose Electric Co., Ltd released a wire-to-board connector that features a 3.96mm pitch with a high current rating of up to 15A for #16 to #18 AWG wiresproviding up to 30 per cent reduction in occupied board area compared to competing products.

The DF63 series connector is available in straight, right-angle and in-line variations ranging from one to six contact positions. It has a crimp contact system with multi-contact points increases reliability and performance. The clear tactile and audible click during engagement ensures complete mating. Its locking structure provides strong retention with a minimum locking strength of 35N for demanding applications.

With a centre position lock system and keying options, the connector can be used for side-by-side mounting to reduce overall package size. Individual contact silos ensure finger-safe operation. The connector is also suitable for potting or resin sealing up to a 5mm high.

Small size and durability of the DF63 make the connector ideal for a wide range of applications including industrial machinery, industrial robotics, medical devices, networking equipment/servers, smart meters, home electronics, white goods, office equipment and gaming equipment.

The connector has operating temperature range of -35C to 105C, limiting contact resistance under 10m? maximum, and has an insulation resistance of 1000M? minimum at 500V DC.





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