Specs available for 400Gb/s interoperable hot pluggable modules

The specifications for CDFP 2.0 interoperable hot pluggable modules are now available. According to the CDFP Multi-Source Agreement, the CDFP interface enables data rates of 25Gb/s over 16 lanes for an aggregate of 400Gb/s on a single module. In addition, it promises exceptional signal integrity, thermal cooling properties and EMI protection, CDFP MSA indicated.

CDFP MSA founder-promoters include Avago Technologies, Brocade Communications, IBM, JDS Uniphase, Juniper Networks, Molex and TE Connectivity, while contributing member companies include FCI, Finisar, Huawei, Inphi, Ixia, Mellanox Technologies, Nextron, Oclaro, Semtech, Sumitomo Electric, Xilinx and Yamaichi Electronics.

Founded in 2013 with the objective of defining specifications and promoting industry adoption, the CDFP MSA announced that it has successfully reached its goals with the completion of mechanical drawings and in-depth design specifications for CDFP 2.0 modules.

Providing a high level of integration, performance and long-term reliability, the CDFP 400Gb/s interface is available in short- and long-body versions. The specifications are compatible for use with direct attach cables, active optical cables and connected optical modules. Geared for client-side interfaces inside the data centre, CDFP modules enable high port density. The compact modules are well suited for low power applications using copper, VCSEL or silicon photonics based technology. The CDFP modules are expected to find use in industry standards targeting 100m of MMF and up to 2km of SMF. For example, the CDFP module can be used for one 400Gb/s interface or to aggregate sixteen 25Gb/s interfaces or four 100Gb/s interfaces.

Complete specifications for the CDFP 2.0 interoperable hot pluggable modules and a complementary white paper titled "CDFP Delivers 400Gb/s Today" are available on the CDFP MSA homepage.