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RF probes offer mechanical reliability for semicon test

Posted: 13 Oct 2014 ?? ?Print Version ?Bookmark and Share

Keywords:Everett Charles Technologies? RF probe? RF test?

Two new products from Everett Charles Technologies' ZIP probe portfolio aim to meet signal integrity challenges driven by the ever increasing speed of semiconductors devices. According to the company, the Z0 and Z1 probes are cost effective solutions that offer exceptional mechanical reliability and electrical performance.

"While conventional round probe technology restricts travel and only allows for a small internal contact area, ZIP based on ECT's flat technology offers generous travel and a large contact area. The result is excellent electrical performance for the critical parameters of bandwidth, contact resistance and current capacity. The manufacturing processes used to fabricate ZIP probes are extremely repeatable and stable ensuring probe to probe consistency. Our patented, innovative flat probe technology optimises electrical and mechanical performance," said Tony DeRosa, senior product manager.

Z1

Z1 is ECT's high bandwidth series with a test height of 2.7mm. It offers an insertion loss of about 30Ghz at -1dB. Z0 is ECT's ultra-high bandwidth series. Z0's short test height of 1.5mm and 0.60nH of inductance provides an insertion loss of 40Ghz at -1dB. The probes are available for semiconductor packages with a pitch down to 0.4mm and are applicable for a range of RF testing of applications from lab and characterisation to burn-in to high volume final test, detailed the company.





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