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TI expands presence in China with 300mm bumping facility

Posted: 07 Nov 2014 ?? ?Print Version ?Bookmark and Share

Keywords:Chengdu? 300mm wafer bumping? Texas Instruments?

Texas Instruments Inc. is pressing on with its "long-term China strategy," saying that it will open a 300mm wafer bumping facility in Chengdu. This represents the third leg of TI's strategywhich involves establishing production facilities in the countryunveiled in 2010.

With the new site, TI is striving to assure customers of a "broad-based technology platform," and a "manufacturing foothold that can support a large customer base with big volume needs," Paul Fego, VP of worldwide manufacturing for TI, told EE Times.

With analogue cited as its core business, TI's focus is on its internal production facilities and expanding capacity fast enough to support its rapidly growing analogue and power management IC businesses.

TI's Chendu facility

TI's Chengdu facility (Source: Texas Instruments)

Noting that TI is one of the two analogue companies with 300mm processing capability (Infineon being another), Dean Freeman, research VP at Gartner, said that the new wafer bumping facility helps TI maintain leadership in 300mm analogue technology.

[See also: TI sets up seventh assembly/test facility in China]

According Gartner, TI grabbed a 21.4 per cent share in 2013 of a $19.4 billion total analogue market. The market research firm estimates $21.154 billion in revenue in 2014.


Bumping is completed prior to assembly. The process replaces wire bonding as the interconnection by applying solder, in the form of bumps, or balls, to a device at the wafer level, according to TI. Gartner's Freeman explained that bumping is "one of the many packaging methods for devices and tends to be the favoured manufacturing method for wafer level packaging."

Fego sees bumping as an "absolutely critical" manufacturing process for advanced packaging technologies.

Because bumping comes in so many different flavours, the process leverages proprietary technologies that help differentiate analogue chips. A certain flavour of bumping is used to improve speed in embedded chips, for example, while another delivers the smaller size or thinness needed by higher density chips, Fego explained.

TI's new 300mm wafer bumping facility will accommodate a variety of bumping processes. "We will first establish a base technology, go through the learning curve, and offer bumping our customers' devices need," Fego said.

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