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Manufacturing/Packaging??

GQFN package shrinks devices by up to 60%

Posted: 12 Nov 2014 ?? ?Print Version ?Bookmark and Share

Keywords:GQFN? fine pitch ball grid array? wafer level chip scale package?

UTAC Holdings Ltd (UTAC) marks a milestone with its grid array flat no-lead (GQFN) package, offer several advantages over conventional QFN or QFP packages with a 40 per cent to 60 per cent reduction in package size, as well as improved electrical performance through lower inductance and capacitance.

The Singapore-based semiconductor testing and assembly services provider said that the packaging technology has received customer qualification and is proceeding with industrial-scale production in Thailand in the first quarter of 2015.

GQFN

Electrical performance comparison: QFP, QFN and GQFN. (Source: UTAC)

GQFN technology enables lead frame-based packages to deliver full array interconnect density, providing customers with a lower cost alternative for devices that to date would require a fine pitch ball grid array or a wafer level chip scale package technology.

[See also: Guide to the assembly of GQFN, DFN packages]

The broad technology platform UTAC developed in GQFN includes wire bond, flip chip, stacked die and system-in-a-package (SIP) integration capabilities. According to the company, the said technologies make the package suitable for many applications used in mobile communications, automotive, industrial, computing and consumer, which supporting analogue, mixed signal, logic, MEMS sensor and RF devices.

UTAC is an early pioneer in development and production of QFN packages, boasting 17 years of track record. It is currently one of the largest QFN package producers globally, shipping around 4 billion units per year.

UTAC leadless lead frame

UTAC leadless lead frame milestones.





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