Global Sources
EE Times-Asia
Stay in touch with EE Times Asia
EE Times-Asia > T&M

Ultratech outs in-line inspection system for patterned wafers

Posted: 19 Nov 2014 ?? ?Print Version ?Bookmark and Share

Keywords:Ultratech? in-line inspection system? patterned wafer? 3D topography? CGS?

Ultratech Inc. has unveiled the Superfast 4G high-volume, in-line, 3D topography inspection system that promises to deliver the industry's highest-productivity and lowest-cost solution compared to competing systems. According to the company, the system's patented coherent gradient sensing (CGS) technology offers a high degree of flexibility that allows Ultratech customers to use a single type of wafer inspection tool to measure the front side of patterned wafers across the entire fab line at the lowest cost.

The Superfast 4G features direct, front-side 3D topography measurement for patterned wafers; 125wph throughput for in-line, patterned wafer system; flexibility to measure front side of patterned wafers anywhere in the production line, (front-, middle- and back-end-of-line); open-architecture inspection platform that can improve lithography performance; and small wafer-shaped inspection footprint that claims to significantly cut customer production costs compared to competing systems.

"By working with leading-edge memory and logic customers using Ultratech's 3G systems, we were able to successfully implement the industry's requirements for 3D topography with in-line inspection tools. Ultratech invested heavily in the algorithm and factory automation capabilities, expanded manufacturing capacity in Singapore and developed regional senior applications managers to help ensure a smooth ramp to volume production. Ultratech also made significant improvements to the Superfast 4G inspection system, resulting in increases of 2.5x in performance and 65 per cent in throughput, as well as a 30 per cent reduction in edge exclusion, compared to the 3G system. Moreover, the two inspection systems have identical process modules retaining all critical optical components ensuring a smooth transition from the 3G to the 4G system for high-volume production," said Ultratech VP, marketing inspection system and technology transfer, Shrinivas Shetty.

Ultratech plans to begin shipping the Superfast 4G systems in 1Q15.

Article Comments - Ultratech outs in-line inspection sy...
*? You can enter [0] more charecters.
*Verify code:


Visit Asia Webinars to learn about the latest in technology and get practical design tips.

Back to Top