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3D QVGA ToF image sensor offers backside illumination

Posted: 03 Dec 2014 ?? ?Print Version ?Bookmark and Share

Keywords:Espros Photonics? image sensor? ToF? backside illumination? LED driver?

Espros Photonics AG has introduced a 3D time-of-flight QVGA image sensor that provides backside illumination and high sensitivity to near-infrared light. According to the company, the EPC660 has a 320 x 240 CCD pixel field and features control logic to operate the device. The sensor is able to deliver roughly 66 full frame ToF images that can be increased to more than 1,000, added Espros.

All configuration is one via an I2C interface and an integrated EEPROM holds factory settings and production and configuration data. The sensor includes an integrated LED driver capable of driving more than 200mA peak current.


Depending on the system design the sensor can provide millimetre resolution of distance at up to 100m. The high sensitivity of the optical front end allows for reduced IR illumination and thereby minimises overall power consumption. The CCD pixel architecture can tolerate ambient light levels of up 130kLux making the sensor suitable for use outdoors, the company added.

- Peter Clarke
??EE Times Europe

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