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Cypress BLE sol'ns achieve Bluetooth 4.1 qualification

Posted: 11 Dec 2014 ?? ?Print Version ?Bookmark and Share

Keywords:Cypress Semiconductor? Bluetooth Low Energy? LTE? Internet of Things? wearable?

Cypress Semiconductor Corp. has revealed that its highly integrated, single-chip Bluetooth Low Energy (BLE) solutions have earned Bluetooth qualification. The Bluetooth Special Interest Group granted specification 4.1 qualification to the company's link layer component, BLE protocol stack and radio frequency physical layer (RF Phy) used in the PSoC 4 BLE Programmable SoC and PRoC BLE programmable radio-on-chip solutions. Also, the solutions' chip-scale packages (CSP) and quad-flat no-lead (QFN) packages achieved Bluetooth 4.1 qualification, Cypress added.

Cypress Bluetooth Low Energy Pioneer development kit

Cypress Bluetooth Low Energy Pioneer development kit

Bluetooth 4.1 is geared to coexist with cellular technologies that include LTE and deliver better connections and improved data transfer, enabling developers to create innovative Internet of Things (IoT) applications. Customers designing with Cypress' BE solutions can apply to add the Bluetooth logo on their products by referring to Cypress' qualification identification numbers.

The Cypress BLE solutions enable complete systems by integrating a Bluetooth Smart radio, a high-performance 32bit ARM Cortex-M0 core with ultra-low-power modes, programmable analogue blocks and Cypress' CapSense capacitive touch-sensing functionality. This combination of technology delivers unmatched system value for Bluetooth Smart products, with prolonged battery life, customisable sensing capabilities and sleek, intuitive user interfaces, stated the company.

PSoC 4 BLE

PSoC 4 BLE

PSoC 4 BLE delivers unprecedented ease-of-use and integration in a customisable solution for IoT applications, home automation, healthcare equipment, sports and fitness monitors, and other wearable smart devices. PRoC BLE provides a cost-effective turnkey solution for wireless Human Interface Devices (HIDs), remote controls and applications requiring simple wireless connectivity. The solutions also have an on-chip balun that simplifies antenna design while reducing board size and system cost.

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