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Infineon outs royalty-free power modules for high-voltage IGBT

Posted: 15 Dec 2014 ?? ?Print Version ?Bookmark and Share

Keywords:IGBT? power module? Infineon?

Infineon has developed a couple of power module platforms intended to boost the performance of high-voltage IGBTs in voltage classes from 1.2-6.5kV. The company also announced a royalty-free license of the design to all providers of IGBT power modules in order to make the benefits of the module widely available.

First products using the platform concept will include high voltage classes 3.3kV (450A), 4.5kV (400A) and 6.5kV (275A) in a newly-designed package measuring 100 x 140 x 40mm. A package design for lower voltage classes is also being developed.

IGBT power module

Infineon asserts that developments over time have shown, "little modification to the standard packaging technology," in modules used by industrial and traction drives, wind and solar energy systems and long-distance electrical transmission. Through a more than twenty-year history of use, chip technology developments have allowed IGBTs to meet demands for higher energy efficiency and higher operating temperature, as well as miniaturisation, reliability and cost reduction. As applications face more and more demanding and harsh environments this approach is reaching its limit, Infineon believes, making a change in package technology of high-power modules a key to continued performance improvement.

The company stated that its latest module platform addresses emerging system requirements for high-power density, low inductance, energy efficiency, long lifecycle and robustness. Its flexible concept allows the connection of similar parts in parallel, enabling a simplified structure to be used for the DC link terminal and capacitor. The AC terminals can be connected in parallel with only one busbar. The flexibility and scalability of the modules will simplify system design considerably, thus supporting the time-to market requirements of developers. Using the latest package technology the new high-power module also will help to reduce overall system cost and ensure future-proofing of designs.

"Taking into account the increasing challenges IGBT technology is facing, we are very pleased to present a package that answers the needs of our industry both for today and for the foreseeable future. We are most certain that the new module package will be of great benefit for all demanding high-power applications," said Markus Hermwille, Director high power segment of the industrial power control division at Infineon. "It is our aim to secure a broad and reliable base for the supply of the new high-power platform, which is why we are inviting the industry to make use of the design."

- Graham Prophet
??EE Times Europe

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