Electroless copper bath improves IC substrate production

Atotech Deutschland GmbH has announced that its Printoganth MV TP1 that aims to address the increased electroless copper throwing power requirements of the IC substrate industry. The electroless copper bath promises to offer the highest throwing power (TP) into blind micro vias (BMVs) and especially into their wedges. This enables ultra-fine lines and spaces of 10/10um and below.

The successor of Printoganth MV Plus is an easy drop-in solution and fully compatible with Atotech's dedicated and market-leading desmearing and activation processes for SAP technology, the company indicated.

"Printoganth MV TP1's throwing power results are especially outstanding, with values of typically 100 per cent on the capture pad and 70 per cent in the wedges for 50/50um and 60/40um BMVs on ABF

GX-92 laminates," noted Lars-Eric Pribyl, global product manager plating through hole (PTH), Atotech.

Printoganth MV TP1 copper deposit in a BMV (60 x 40um) on ABF GX-92 with 70 per cent throwing power into the wedge

In addition, Printoganth MV TP1 deposits feature a favourable surface morphology, which enables a significantly better dry film adhesion and etchability performance compared to its predecessor, Printoganth MV Plus. Furthermore, peel strength results (for example > 6N/cm on ABF-GX 92) and successfully passed reliability tests such as thermal cycle test (TCT), interconnect stress test (IST), quick via pull test (QVP) and solder shock test (SST) confirm the excellent performance of the electroless copper process.

Printoganth MV TP1 successfully passed its alpha site and recently also the mass production qualification in Japan. Two customers in Japan have switched to Printoganth MV TP1 for their mass production of IC substrates and several other main IC substrate manufacturers in Taiwan, Korea and Japan are presently carrying out sample platings and line tests.

Printoganth MV TP1 has been introduced to the markets and further sample requests are highly welcome.