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UV curable system touts up to 7,000psi tensile strength

Posted: 26 Dec 2014 ?? ?Print Version ?Bookmark and Share

Keywords:Master Bond? UV curable system? semiconductor?

Master Bond Inc. has introduced the UV15X-2 that combines a high performance physical profile with very low shrinkage upon curing. According to the company, the solution combines the properties of a UV curable adhesive, sealant, coating and potting compound, and is geared for bonding dissimilar substrates.

This versatile system combines a high performance physical profile with very low shrinkage upon curing. It is widely used in fibre optic, optical, electronic, microelectronic, semiconductor and laser applications.

Master Bond UV15X-2

With a tensile strength of 6,000-7,000psi, UV15X-2 bonds well to a variety of substrates including glass, metals, ceramics and many plastics, especially polycarbonates and acrylics. It features impressive light transmission properties and has a refractive index of 1.51. This low viscosity system is not oxygen inhibited and cures readily in 10-30s when exposed to a UV light source. The rate of cure depends upon the compound's distance from the light source, the thickness of the section and the intensity of the light source. No solvents or vapours are released during the curing process. UV15X-2 can also be readily cured in sections up to 0.25in thick.

Serviceable over the wide range of -26.7°C to 148.9°C, UV15X-2 is able to withstand rigorous thermal cycling. It resists many chemicals, such as water, oils, fuels, acids and bases. Other notable characteristics include reliable electrical insulation values, dimensional stability and abrasion resistance. UV15X-2 is available in a variety of standard packaging options. It can also be purchased in syringe applicators.

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