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Remtec adds features to direct copper bond substrate

Posted: 21 Jan 2015 ?? ?Print Version ?Bookmark and Share

Keywords:Remtec? direct copper bond? DBC substrate?

Remtec Inc. has revealed that its direct copper bond (DBC) substrate now flaunts additional capabilities. These include solid copper-filled vias and copper-coated bore holes that offer front-to-back connections and thermal paths for better heat management as well as solder mask and assembly options, detailed the company.

Solder mask options include liquid photo image-able LPI for higher resolution patterns, high operating temperature (400°C) solder mask and elevated reflectivity mask for high luminance requirements typical for LED applications. In addition, Remtec complements DBC substrate fabrication with assembly capabilities including flying leads and pin/lug attachment onto metallised ceramics using copper-silver alloy brazing and gold tin soldering.

The company claims to provide a variety of DBC products on alumina and aluminium nitride with many versatile copper finish options including selective gold tin to ensure excellent solderability, wire bondability and product reliability. The use of palladium plating enables economical assembly techniques including SMT soldering, low and high temperature die attach, aluminium wire, gold wire and ribbon bonding.

With the latest features, designers can use front-to-back connections, wire and terminal connections, flow-controlling solder mask and lead, pin and lug attachments on DBC substrates. Added DBC capabilities allow Remtec to address more applications in defence, aerospace, industrial power, medical instrumentation and green technologies.

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