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Compact module packs 10 dies side-by-side in a 2 x 5 array

Posted: 21 Jan 2015 ?? ?Print Version ?Bookmark and Share

Keywords:Nanium? module? eWLB? Analogic? thin-film technology?

Nanium S.A. has unleashed a wafer-level multi-chip module that incorporates 10 dies side-by-side in a 2 x 5 array. Developed for medical applications, the solution measures 33 x 28mm2 and uses the company's Fan-Out/embedded Wafer-Level BGA (eWLB) technology to bring about a compact module.

Balancing dielectric and mould compound stress to create an extremely flat module, the final unit was incorporated within an ultra-compact medical device for visualising vasculature and guiding peripheral intravenous access, Analogic's Sonic Window handheld ultrasound device.

The final package's 10 dies, interconnected by edge die pads, have only 200um between them. As not only size, but also thickness was one of the main concerns voiced by the customer, thin-film technology process redistribution layer (RDL) was chosen in place of the previously considered flex substrate, and micro pillars were found as an alternative to conventional BGA solder ball bumping. The final units have 6,000Cu/Ni/Au micro pillars with 200um diameter, 300um pitch and 10um height.

- Julien Happich
??EE Times Europe





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