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Rudolph sends JetStep for fan-out packaging apps

Posted: 05 Feb 2015 ?? ?Print Version ?Bookmark and Share

Keywords:OSAT? FO-WLP? wafers? substrates? reduction stepper?

Rudolph Technologies Inc. has sent the JetStep W Series to a new outsourced assembly and test (OSAT) customer for fan-out wafer level packaging (FO-WLP) applications.

Rudolph's JetStep Advanced Packaging Lithography Systems have been specifically designed to meet the challenges of newly developed processes now emerging in back-end manufacturing. The JetStep W Series is intended for use with wafers or other round substrates. The JetStep S Series is for square or rectangular substrates. Both systems feature a 2X reduction stepper with a large field of view (52mm x 66mm) to improve exposure efficiency and throughput. The JetStep system handles a range of substrates, including glass interposers, square or rectangular substrates up to 720mm by 600mm, and standard or reconstituted wafers from 300mm to next-generation 450mm diameters; and to accommodate the warped substrates that frequently occur in these processes. An onboard, automated reticle library, holding up to 30 reticles, and adjustable field apertures combine to increase throughput and flexibility. These and other purpose-designed features, such as the large automatic magnification compensation range, provide benefits in advanced package applications that are unavailable from legacy lithography tools initially designed for front-end, wafer-based processes.

The JetStep stepper is part of a closed-loop lithography solution that integrates the stepper with other Rudolph systems and software, including the NSX Series for defect inspection and CD and overlay metrology; ProcessWORKS software for run-to-run, closed-loop process control; ARTIST software for fault detection and classification; Discover software for fabwide yield management; and the S3000S and SONUS product families for film thickness measurements.





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