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SMIC, Cista boast 8MP CIS prod'n on 0.13?m BSI

Posted: 03 Mar 2015 ?? ?Print Version ?Bookmark and Share

Keywords:SMIC? CMOS? image sensor? BSI? back-side illumination?

Semiconductor Manufacturing International Corp. (SMIC) and Cista System Corp. have jointly announced mass production of two CMOS image sensors (CIS)-back-side illumination (BSI) products featuring 1.3MP resolution with 1.75?m pixel and 8MP resolution with 1.4?m pixel, respectively. According to the companies, the sensors are based on SMIC's independently developed 0.13?m BSI technology platform.

BSI CMOS image sensor technology increases the amount of light captured by the sensor, and thus enables image sensors with improved low-light performance. SMIC claims that its 0.13?m CIS-BSI technology offers competitive performance. Based on a low leakage process, it only uses three aluminum metal layers for reduced cost and supports pixel sizes down to 1.4?m for 8MP resolution CIS. SMIC also provides full in-house turn-key service that includes CIS wafer fabrication, colour filter and micro-lens processing, TSV-CSP and testing to help customers shorten the supply chain with fast cycle time and low cost.

"Through working with our partner, Cista System, we are very pleased with the achievement of the production phase for BSI technology," said Shiuh-Wuu Lee, EVP of technology development of SMIC. "Tests on the two sensors have shown great performance which demonstrates our readiness in 0.13?m BSI technology platform. SMIC is also developing 1.1?m pixel BSI for 13MP resolution and above, and 3D stacked BSI for high-end applications. With these new sets of products, we hope to provide high-quality CMOS image sensors to our customers at a competitive price."

"We are excited to partner with SMIC on launching the CIS-BSI sensors," said Wilson Du, CEO and president of Cista System. "This partnership draws us one step closer to our goal of becoming more integrated with domestic industry resources in developing the image sensor sector. As we move forward, we hope to see more of our designs used in wider applications such as consumer electronics, telecommunications, medical equipment, automotive industry, automation and other applications."





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