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Embedded die in substrate shows promise in processing tech

Posted: 05 Mar 2015 ?? ?Print Version ?Bookmark and Share

Keywords:Yole Développement? embedded die? substrate? FOWLP?

Yole Dveloppement has released its latest report titled "Fan-out and Embedded Dies: Technologies & Market Trends" that describes embedded die in substrate as a promising packaging technology. According to Yole's team, this approach becomes more and more attractive for potential customers because of the many advantages it provides.

"The embedding allows a smaller form-factor, and it can be done using a mature manufacturing chain, providing low costs," said Jerome Azemar, technology & market analyst, advanced packaging and manufacturing at Yole. "The approach also offers good thermal performance, high integration capability and low inductance thanks to shorter connections."

But these advantages still have to be realistic at high volume manufacturing scales before being able to convince customers. Embedding die in laminate substrates is indeed a promising packaging principle, but it has to overcome several challenges.

One of these challenges is the supply chain. The process is being pushed by PCB manufacturers such as AT&S and can create a new supply chain, bringing new players into the semiconductor industry. This new supply chain comes along with new business models, including packagers, module sellers, IDMs pushing for embedding solutions and R&D laboratories.

Embedded die package and FOWLP revenues forecast

One of the supply chain's main advantages is the usage of a mature and affordable manufacturing chain created initially for PCB manufacturing. That achieves low cost technology that would allow easier component integration, with easy access to both sides of the chips. However, a new supply chain brings with it a lack of technical experience with embedding processes and questions about business models that require clarification.

Embedded die strategy and status per player

Under the report "Fan-out and Embedded Dies: Technologies & Market Trends," Azemar and the advanced packaging team, analyse the applications that will drive the embedded die market in the future and the potential keys for success.

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