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Embedded die in substrate shows promise in processing tech

Posted: 05 Mar 2015 ?? ?Print Version ?Bookmark and Share

Keywords:Yole Développement? embedded die? substrate? FOWLP?

Single die are the first products currently being sold, demonstrating the technology's capabilities.

They are essentially low I/O applications with easy to embed dies such as DC/DC converters for wireless products. Yole's expectations are that the technology will show its real potential with more complex systems such as power application SiPs. There, actives and passives will fully benefit from embedded packages thanks to good heat management and low inductance.

Among the technical requirements, one is especially important: pad pitch on the die. In order to reach volume in the mobile/wireless market, pad pitch has to go below 150?m. Some players, such as TDK-EPCOS, claim they already have products with 50m pitch.

If technical and logistic objectives such as this are achieved, and if an application provides a real boost in terms of initial large volumes, the overall market will be able to grow rapidly in the near future.

Under this advanced packaging technology & market study, Yole, the More than Moore market research and strategy consulting company gives an overview of players involved in embedded die packages. The company describes the strategies it is hoping will overcome technical issues such as yield, resolution and reliability and their choices of business model to enter the semiconductor packaging market with.

FOWLP strategy and status per player


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