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Power module packaging eases power electronics issues

Posted: 20 Mar 2015 ?? ?Print Version ?Bookmark and Share

Keywords:Yole Developpement? power module? packaging? electric vehicle? encapsulation?

The power packaging market is on an uphill climb, driven by the interconnection and substrate segments, respectively 14 per cent and 13 per cent between 2014 and 2020, according to Yole Developpement. In fact, global growth for raw material is forecast to hit 12 per cent in the said period, with a global market of $1.7 billion for 2020.

Based on the latest report, Yole's analysts proposed a deep understanding of the power module packaging design especially at the substrate, thermal interface materials, baseplate, encapsulation, die attach and interconnection levels. With an approach mixing technologies trends and market needs, the power electronics team, managed by Pierric Gueguen, reviews the technical issues and analyses the market evolution.

Standard power module packaging design

In order to increase power module yield and reliability, companies are working on novel products for power packaging, especially for the common failure locations, die and substrate attach, interconnection and encapsulation. Both new designs and materials can be used, whether to eliminate levels of connection or to improve interfaces. In die attach, for instance, soldering is progressively losing market share, which benefits silver sintering. Although the basic material is more expensive, taking into account cheaper equipment and manufacturing costs and improved reliability, this technology is seducing even more players. Standard wire bonding is evolving as well, with solutions increasing contact surface, such as ribbon or ball bonding. Encapsulation technologies must evolve to handle high operating temperatures: standard silicone gel or epoxy are limited in terms of temperature, and so new materials such as parylene are being developed.

"Developments for power packaging are needed because power electronics is facing many challenges, due to both environmental and technical requirement," said Coralie Le Bret, technology and market analyst, power electronics and compound semiconductors technologies at Yole. "Increasing power density and power conversion optimization for CO2 emission reduction are key," she added. To achieve ambitious governmental targets and to respect volume constraints, technology breakthroughs are needed at device and module level. Moreover, the growing and important role of wide band gap (WBG) semiconductors makes efficient packages mandatory, so that devices' high frequency, high voltage or high temperature capabilities can be best exploited.

Power module material market size evolution


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