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Altera delivers UBM-free WLCSP

Posted: 08 Apr 2015 ?? ?Print Version ?Bookmark and Share

Keywords:Field programmable gate arrays?

Altera and TSMC announced a UBM-free (under-bump metallisation-free) wafer-level chip scale package (WLCSP) designed for Altera's MAX 10 field programmable gate arrays (FPGAs).

The thin 0.5mm WLCSP is ideal for space-constrained applications such as sensor applications, small form-factor industrial equipment and portable electronics. Other benefits include a better than 200 per cent improvement in board-level reliability compared to standard WLCSP, while enabling a large die size envelope and high package I/O count, targeting applications such as wireless LAN (WLAN) and power management ICs (PMIC). It also enhances copper routing capability and inductor performance.

"Altera's work with TSMC has produced a very advanced and integrated packaging solution for MAX 10 devices," said Bill Mazotti, vice president of worldwide operations and engineering at Altera. "Leveraging this innovative technology to improve integration, quality and reliability makes MAX 10 FPGA products more versatile and useful for our customers."

Altera's MAX 10 FPGA products deliver advanced processing capabilities in a single-chip, small-form-factor programmable logic device. Building upon the single-chip heritage of previous MAX device families, densities range from 2K C 50K logic elements (LEs), using either single or dual-core voltage supplies. MAX 10 FPGA devices are built on TSMC's 55nm embedded NOR flash technology that enables instant-on functionality.

Altera is currently sampling MAX 10 FPGA products with the new WLCSP packaging. There are 81-pin and 36-pin WLCSP packages available.

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