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Multipurpose module predicts IC failure

Posted: 20 Apr 2015 ?? ?Print Version ?Bookmark and Share

Keywords:Multipurpose electromigration module? MPEM? copper interconnects? IC? CVEM?

Cascade Microtech, Inc. unveiled a Multipurpose Electromigration (MPEM) module featuring an intuitive, full-featured test suite for predicting the lifetime and reliability of copper interconnects in modern integrated circuits. The new MPEM module offers researchers a broadly capable tool with multiple electromigration (EM) test applications in one convenient, low-cost, high-performance system.

Research indicates a need for new approaches in evaluating the reliability of copper lines and vias in advanced semiconductor processes. Test techniques including constant voltage EM (CVEM) show to complement well the traditional method of constant current EM (CIEM) stress. With MPEM, Cascade Microtech provides an EM test to support this intriguing new CVEM evaluation method.

"Extremely scaled interconnects at 7nm and beyond will necessarily have dramatically different barrier layer characteristics which, in turn, alter the behaviour of conductors as they experience the primary EM failure mechanism of void formation," said Kristof Croes, Ph.D, senior researcher and group leader, Reliability, Electrical Test, and Modeling, imec. "Constant voltage EM induces more realistic biases that lead to better void detection capability. Therefore, a constant voltage EM approach could become a better alternative for future generation interconnects."

The new MPEM module provides multiple stress bias types for testing copper interconnects, typically with geometries of 32nm or less. With MPEM, the company added constant voltage electromigration (CVEM) and low frequency pulsed current electromigration (LFPEM) applications to its existing line-up of constant current electromigration (CIEM) and stress migration capabilities.

Offering versatility by providing three types of EM tests in one convenient platform, customers can compare multiple test methods. Additionally, the MPEM module effectively leverages the traditional advantage of Cascade Microtech's EM solutions: a fully parallel, high-speed measurement system that is uniquely capable of capturing momentary, self-healing voids. The system offers a broad measurement range, with set points as low as 10?A or 10mV.

Cascade Microtech's 1164 and Symphony systems with MPEM modules are fully integrated tools for these combined interconnect test applications. 1164 and Symphony systems provide package- and wafer-level solutions with high parallel capacity for efficient testing, multiple test types in a single flexible platform, very long life device under test (DUT) boards, and a rapid continuous measurement technique to ensure rigorous technology evaluation. The 1164 system's Notebook Oven architecture offers flexibility and efficiency/throughput advantages for package-level reliability (PLR) testing.





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