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Photorelays boast industry's smallest package

Posted: 18 May 2015 ?? ?Print Version ?Bookmark and Share

Keywords:Toshiba? photorelay? test equipment?

Toshiba Electronics Europe has announced six devices from its portfolio of photorelays housed in a VSON4 package that according to the company is the industry's smallest for photocoupler products. The additional products to the TLP34xx series claim to provide low off-state capacitance, low on-state resistance and high voltage support.

The devices support trigger LED currents of 3mA (max.) and isolation voltage of 300Vrms(min.). By expanding the variation of voltage and "C x R," the photorelays can support a range of applications including semiconductor testers, measurement equipment, automatic test equipment as well as working as replacements to reed relays.

TLP34xx series

The products have the same electrical characteristics as Toshiba's USOP4 series, but reduce required assembly area by about 50 per cent by using the VSON4 package that measures 1.5mm x 2.5mm x 1.3mm thick. This can contribute to smaller and thinner products, and also makes it possible to significantly increase the number of photorelays on a circuit board without increasing its size.

The lineup includes TLP3442, which realises the industry's lowest off-state capacitance (COFF), 0.3pF (typ.) and TLP3431, which is suited for high-frequency signal transmission with a low on-state resistance (RON) of 0.8? (typ.), stated the company.





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