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Peregrine, GlobalFoundries unveil RF SOI 300mm platform

Posted: 08 Jul 2015 ?? ?Print Version ?Bookmark and Share

Keywords:Peregrine Semiconductor? GlobalFoundries? RF SOI? silicon on insulator? CMOS?

Peregrine Semiconductor Corp. has rolled out what it touts as the industry's first RF (silicon on insulator) SOI technology built on GlobalFoundries' 130nm 300mm RF technology platform. To develop the next-generation UltraCMOS 11 platform, Peregrine collaborated with tier-one fab GlobalFoundries.

RF SOI 300mm tech

UltraCMOS 11 technology uses a custom fabrication flow from GlobalFoundries' modern Fab 7 facility in Singapore. By moving to a 300mm wafer, Peregrine opens the door to enhancements and advanced features in future generations of the UltraCMOS technology platform, which can leverage GlobalFoundries' 300mm production-proven design enablement and manufacturing expertise and scale, the company indicated.

The UltraCMOS 11 platform will be the foundation for Peregrine's high volume mobile products and SOI products for other applications. It builds on the success of the UltraCMOS 10 technology platform, also developed and manufactured by GlobalFoundries, and offers unparalleled performance and cost-competitive advantages, added the companies.

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