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Global IC packaging markets log in $48B revenue in 2014

Posted: 07 Aug 2015 ?? ?Print Version ?Bookmark and Share

Keywords:New Venture Research? IC packaging? smartphone? OSAT? semiconductor?

According to the latest data from New Venture Research, the IC packaging market is experiencing robust health with worldwide revenues of $48 billion in 2014 and YoY growth surpassing 10 per cent. In addition, annual revenues will continue to grow quickly and are expected to hit $63 billion by 2019.

"The primary driver of this growth is the continuous consumer demand for greater functionality in smaller products," said NVR senior analyst Jerry Watkins. "The explosive growth of smartphones and other handheld communications products has created a dynamic market for near-chip scale packages." As explained in the report, market segments that are expected to benefit the most from these trends are QFNs, BGAs and WLPs, each of which will grow at a CAGR of more than six per cent over the next five years.

The report provides a particular focus on the OSAT market, the outsourced semiconductor assembly and test vendors. This market sector commands more than half the revenues generated by the IC packaging market and their influence will continue to grow in the coming years. In addition to forecasting the OSAT market, the report includes profiles of forty competitors located around the world.

"The leading OSATs have not merely filled the low end of the market that the IDMs are no longer much interested in," stated Jerry Watkins, senior industry analyst for IC packaging, NVR. "They have become partners with the fabless semiconductor companies to develop new and innovative packaging technologies that will carry the industry into the next generation of packages, and are manufacturing some of the most advanced packaging types."





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