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Upcoming IEEE conference to focus on key IoT tech

Posted: 11 Sep 2015 ?? ?Print Version ?Bookmark and Share

Keywords:IoT? CEA Leti? smartphone? 3D integration? SOI?

The IEEE S3S Conference 2015, Sonoma, CA, schedule to take place from October 5-8, aims to tackle the key technologies for the IoT era. For emphasis, it is now accepted that the needs of the emerging IoT market are different from those that fuel the high volume PC and smartphone markets.

The following CEA Leti slide illustrates this industry bifurcation where traditional mass products follow the, ever more expensive, scaling curve, while IoT devices, with their focus on cost, power, flexibility and accessibility, will seek place near its minimum.

IoT tech

The current high volume is focused on a handful of foundries and SoC vendors driving a number of designs at extremely high development cost each, processed at the most advanced nodes, with minimal processing options. In contrast, the emerging IoT market is looking for older nodes with lower development costs, broad range of process options, with many more players both at the foundry side and the design side.

For the IoT market the key enabling technologies are extreme low power, as enabled by SOI and sub-threshold design, integrating with multiple sensor technologies and communication technologies that ca be enabled by 3D integrations. All of these combined in forming the IEEE S3S unified conference.

This year conference includes many papers and invited talks. It starts with three plenary talks: Gary Patton, CTO of Global Foundries: New Game Changing Product Applications Enabled by SOI; Geoffrey Yeap, VP at Qualcomm: The Past and Future of Extreme Low Power (xLP) SoC Transistor, embedded memory and backend technology; and Tsu-Jae King Liu, chair of EE division, Berkeley University: Sustaining the Silicon Revolution: From 3D Transistors to 3D Integration.

Tsu-Jae King will present in her talk an extremely low-power nano-mechanical switch that could be fabricated within the metal stack. The slide below describes some of its characteristics.

Nano-mechanical switch

Joachin Burghartz, professor at the Institute for Microelectronics Stuttgart, will deliver an invited talk on "Ultra?thin Chips for Flexible Electronics and 3D ICs" that will present a process technology to fabricate flexible devices 6?m to 20?m thin. This process flow is being used in manufacturing in their Stuttgart fab, as described below:

Flexible device manufacturing


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