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Upcoming IEEE conference to focus on key IoT tech

Posted: 11 Sep 2015 ?? ?Print Version ?Bookmark and Share

Keywords:IoT? CEA Leti? smartphone? 3D integration? SOI?

Another interesting discussion will be presented by NASA scientist Jin-Woo Han who will describe "Vacuum as New Element of Transistor" as shown below.


These transistors are made of "nothing" and could be constructed within the metal stack, forming monolithic 3D integration with silicon-based fabric underneath.

The conference includes many more interesting invited talks and papers covering the full spectrum of IoT enabling technologies. In addition, the conference offers short course on SOI application and monolithic 3D integration, and a fundamental class on low voltage logic.

Monolithic 3D

Among the papers we will present "Modified ELTRAN: A Game Changer for Monolithic 3D" that shows a practical flow for exiting fab to process monolithic 3D devices using their exiting transistor process and equipment. This flow leverages the work done by Canon about 20 years back called ELTRAN, for Epitaxial Layer Transfer. By deploying the elements of this proven process, a multilayer device could be built first by processing a multilayer transistors fabric at the front end of line, and then process the metal stacks from both top and bottom sides. The following slide illustrates the resulting monolithic 3D structure.

New technologies are an important part of the future of semiconductor industry, and a conference like the S3S would be a golden opportunity to step away for a moment from the Silicon Valley, and learn about non-silicon and silicon options that promise to shape the future.

- Zvi Or-Bach
??MonolithIC 3D

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